Semiconductor device and semiconductor device manufacturing method
AssigneeFuji Electric Co., Ltd.
InventorsKoji Osaki, Yuichiro Hinata
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor chip having a main electrode on a front surface thereof, a wiring board having a front surface to which a rear surface of the semiconductor chip is bonded, a sealing member sealing the wiring board and the semiconductor chip, and an adhesive layer including at least two adhesive films that are laminated to each other. The adhesive layer is provided on surfaces of the wiring board and the semiconductor chip so that the sealing member seals the wiring board and the semiconductor chip via the adhesive layer. As a result, the sealing member is able to reliably seal the semiconductor chip and wiring board via the adhesive layer, thereby preventing an occurrence and extension of separation.
Claims12
A semiconductor device, comprising:
- a semiconductor chip having a main electrode on a front surface thereof;
- a wiring board having a front surface to which a rear surface of the semiconductor chip is bonded;
- a sealing member sealing the wiring board and the semiconductor chip;
- and
- an adhesive layer including at least first and second adhesive films that are laminated to each other, the adhesive layer being provided on surfaces of the wiring board and the semiconductor chip so that the sealing member seals the wiring board and the semiconductor chip via the adhesive layer, wherein
- the second adhesive film is disposed on the first adhesive film such that the second adhesive film is not in direct contact with the front surface of the semiconductor chip.
A semiconductor device, comprising:
- a semiconductor chip having a main electrode on a front surface thereof;
- a wiring board having a front surface to which a rear surface of the semiconductor chip is bonded;
- a sealing member sealing the wiring board and the semiconductor chip;
- an adhesive layer including at least two adhesive films that are laminated to each other, the adhesive layer being provided on surfaces of the wiring board and the semiconductor chip so that the sealing member seals the wiring board and the semiconductor chip via the adhesive layer;
- and
- a case housing the semiconductor chip and the wiring board, the adhesive layer being provided on the semiconductor chip and the wiring board, the sealing member sealing an inside of the case,
- wherein the adhesive layer further covers at least a portion of an inner surface of the case.
A semiconductor device manufacturing method, comprising:
- preparing a wiring board and a semiconductor chip;
- bonding the semiconductor chip to the wiring board;
- forming a plurality of adhesive films that are laminated to each other to cover a front surface of the wiring board and a surface of the semiconductor chip to thereby form an adhesive layer;
- and
- applying a sealing member all over the adhesive layer for sealing, wherein
- the forming of the adhesive layer includes repeating, a plural number of times, a process of applying an adhesive material on the front surface of the wiring board and the surface of the semiconductor chip and drying the adhesive material to form one of the plurality of adhesive films.
Dependencies are inferred from the claim text.