Semiconductor device

A semiconductor device comprising:

• a conductive support member including a first die pad and a second die pad spaced apart from the first die pad in a first sense of a first direction perpendicular to a thickness direction and held at a potential different from a potential of the first die pad;
• a first semiconductor element mounted on the first die pad;
• a second semiconductor element mounted on the second die pad and forming an output-side circuit together with the second die pad;
• a third semiconductor element;
• and
• a sealing resin covering at least a portion of the conductive support member, the first semiconductor element and the second semiconductor element, wherein
• the first semiconductor element includes:
• a circuit part forming an input-side circuit together with the first die pad;
• and
• an insulating part that transmits a signal between the input-side circuit and the output-side circuit and provides electrical insulation between the input-side circuit and the output-side circuit,
• the conductive support member includes:
• a plurality of input-side terminals spaced apart from each other in the first direction, at least one of the plurality of input-side terminals being electrically connected to the input-side circuit;
• and
• a plurality of output-side terminals spaced apart from each other in the first direction, at least one of the plurality of output-side terminals being electrically connected to the output-side circuit, and
• the sealing resin includes:
• a first side face offset in a first sense of a second direction perpendicular to the thickness direction and the first direction, the plurality of input-side terminals protruding from the first side face;
• a second side face offset in a second sense of the second direction, the plurality of output-side terminals protruding from the second side face;
• a third side face offset in the first sense of the first direction and connected to the first side face and the second side face;
• and a fourth side face offset in a second sense of the first direction and connected to the first side face and the second side face,
• the conductive support member is not exposed on the third side face,
• the conductive support member includes:
• a third die pad spaced apart from the first die pad in the second sense of the first direction and held at a potential different from the first die pad;
• and
• a plurality of second output-side terminals spaced apart from each other in the first direction and protruding from the second side face,
• the third semiconductor element is mounted on the third die pad and forms a second output-side circuit together with the third die pad,
• the insulating part transmits a signal between the input-side circuit and the second output-side circuit and provides electrical insulation between the input-side circuit and the second output-side circuit,
• at least one of the plurality of second output-side terminals is electrically connected to the second output-side circuit, and
• the conductive support member is not exposed on the fourth side face.