Package structure, semiconductor device, and formation method for package structure
AssigneeRohm Co., Ltd.
InventorKazunori Fuji
Life of this patent
Estimating the term…
Abstract
A package structure includes a metal member and a resin member. The metal member has an obverse surface facing one side in a first direction. The resin member is disposed in contact with at least a portion of the obverse surface. The obverse surface has a roughened area. The roughened area includes a plurality of first trenches recessed from the obverse surface, each of the first trenches having a surface with a greater roughness than the obverse surface. The plurality of first trenches extend in a second direction perpendicular to the first direction and are next to each other in a third direction perpendicular to the first direction and the second direction. The plurality of first trenches are filled up with the resin member.
Claims12
A semiconductor device comprising:
- first and second semiconductor elements having a first electrode and a control electrode formed on an obverse surface side and a second electrode formed on a reverse surface side, the first and second semiconductor elements performing a switching operation between the first electrode and the second electrode in accordance with a signal input to the control electrode;
- a first conductive member electrically connected to the second electrode of the first semiconductor element;
- a second conductive member electrically connected to the second electrode of the second semiconductor element;
- a first terminal including a first terminal portion, being partially overlapped with the first conductive member as viewed in a first direction, and being conductively bonded to the first conductive member at the overlapped part;
- a second terminal including a second terminal portion, and being electrically connected to the first electrode of the second semiconductor element;
- and
- a sealing resin for covering the first and second semiconductor elements, and a terminal portion other than the first and second terminal portions,
- wherein a first roughened area is formed on a region along a peripheral portion of the sealing resin on a surface contacting the sealing resin of the first conductive member,
- a second roughened area is formed on the region along the peripheral portion of the sealing resin on a surface contacting the sealing resin of the first terminal,
- the first roughened area formed on the first conductive member and the second roughened area formed on the first terminal have an approximately rectangular shape, and include a plurality of first trenches formed in a third direction orthogonal to the first direction and a second direction so as to be parallel to one another,
- the first roughened area of the obverse surface includes a plurality of ridges, each of the plurality of ridges being between two of the plurality of first trenches adjacent to each other in a third direction orthogonal to the first direction and the second direction,
- as viewed in the first direction, the plurality of first trenches and the plurality of ridges are continuous from one edge of the first roughened area in the second direction to another edge of the first roughened area in the second direction, and
- as viewed in the first direction, each of the plurality of first trenches extends linearly in the second direction.
Dependencies are inferred from the claim text.