Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
AssigneeKaijo Corporation
InventorHiromi Fujisawa
Life of this patent
Estimating the term…
Abstract
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.
Claims11
A wire loop comprising:
- a wire connecting a first bonding point and a second bonding point therethrough;
- said wire including a ball bonded to said first bonding point, a neck portion adjacent to said ball and a major portion extending from said neck portion to said second bonding point;
- wherein said major portion of said wire has a crushed part formed in proximity to said neck portion by crushing the part of said wire together with a top portion of said ball so that the wire extends in one direction away from said bonding point at a first position and the crushed part extends in another direction to contact the bonding point at a second position.
A semiconductor device comprising:
- a first bonding point;
- a second bonding point spaced from the first bonding point;
- and
- a wire bonded to said first bonding point and said second bonding point to connect said first bonding point and said distal second bonding point therethrough;
- wherein said wire includes a ball bonded to said first bonding point, a neck portion adjacent to said ball and a major portion extending from said neck portion to said distal second bonding point;
- and
- wherein said major portion of said wire has a crushed part formed in proximity to and at a distal side of said neck portion by crushing a part of said wire together with a top portion of said ball.
An improved wire loop connector for electrical connection between a semiconductor device and a lead frame comprising:
- a wire body of a predetermined length;
- a first end of the wire body for electrical connection with the semiconductor device having an immediately adjacent first overlaid length of the wire body to double the overall thickness of the wire body at the electrical connection;
- and
- a second distal end of the wire body for electrical connection with the lead frame having a thickness of the wire body wherein the height of the wire body relative to a distance above the semiconductor device is restricted.
Dependencies are inferred from the claim text.