Security wire over stitch bond
AssigneeTexas Instruments Incorporated
InventorsAniceto Rabilas, Jr., Ray Fredric De Asis, Jason Colte
Life of this patent
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Abstract
An electronic device includes a package structure, a conductive terminal exposed outside the package structure, a semiconductor die in the package structure, and a bond wire having contiguous first and second portions. The first portion has a first end and a second end, the first end connected to the semiconductor die by a first bond and the second end connected to the conductive terminal by a second bond. The second portion has a first end and a second end, the first end of the second portion connected to the second end of the first portion, and the second end of the second portion connected to the conductive terminal by a third bond.
Claims14
An electronic device, comprising:
- a package structure;
- a conductive terminal exposed outside the package structure;
- a semiconductor die in the package structure;
- and
- a bond wire enclosed by the package structure and having contiguous first and second portions, the first portion having a first end and a second end, the first end of the first portion connected to the semiconductor die by a first bond, the second end of the first portion connected to the conductive terminal by a second bond, the second portion having a first end and a second end, the first end of the second portion connected to the second end of the first portion, and the second end of the second portion connected to the conductive terminal by a third bond, wherein a loop formed by the second portion encircles a gap and the gap becomes narrower towards the third bond.
Dependencies are inferred from the claim text.