H10W 72/547
Dispositions of multiple bond wires
Official title: {Dispositions of multiple bond wires}
H10W72/547 (Dispositions of multiple bond wires) appears on 7,242 US grants and 7,192 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,242
- Published applications
- 7,192
- Assignees
- 1,332
- Inventors
- 11,057
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 6 | 0 |
| 1984 | 2 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 15 | 0 |
| 1988 | 6 | 0 |
| 1989 | 16 | 0 |
| 1990 | 21 | 0 |
| 1991 | 39 | 0 |
| 1992 | 52 | 0 |
| 1993 | 39 | 0 |
| 1994 | 59 | 0 |
| 1995 | 65 | 0 |
| 1996 | 91 | 0 |
| 1997 | 94 | 0 |
| 1998 | 125 | 0 |
| 1999 | 141 | 0 |
| 2000 | 137 | 0 |
| 2001 | 158 | 85 |
| 2002 | 178 | 262 |
| 2003 | 205 | 253 |
| 2004 | 231 | 248 |
| 2005 | 196 | 324 |
| 2006 | 228 | 311 |
| 2007 | 201 | 346 |
| 2008 | 173 | 351 |
| 2009 | 219 | 369 |
| 2010 | 283 | 357 |
| 2011 | 337 | 375 |
| 2012 | 332 | 354 |
| 2013 | 330 | 349 |
| 2014 | 377 | 332 |
| 2015 | 307 | 375 |
| 2016 | 335 | 315 |
| 2017 | 324 | 311 |
| 2018 | 279 | 252 |
| 2019 | 286 | 260 |
| 2020 | 242 | 281 |
| 2021 | 202 | 257 |
| 2022 | 224 | 289 |
| 2023 | 198 | 222 |
| 2024 | 207 | 149 |
| 2025 | 163 | 108 |
| 2026 | 79 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Jump-fusing and tailored PCB system for loop inductance reduction8 Sep 2026US 12,733,513 B2Texas Instruments Incorporated
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Radio frequency (rf) interconnect configuration for substrate and surface mount device27 Aug 2026US 2026/0255997 A1Ciena Corporation
- Sensor chip and sensor device having the same27 Aug 2026US 2026/0256008 A1TDK Corporation
- Semiconductor devices with selectively disabled bond pads for cascade wire bonding20 Aug 2026US 2026/0248047 A1Micron Technology, Inc.
- Power module for solid-state circuit breaker6 Aug 2026US 2026/0231762 A1Zapadoceska Univerzita V Plzni
Most cited
By later US patents
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Polarless surface mounting light emitting diode1,041US 7,714,334 B22010
- Implantable microstimulator841US 5,324,316 AAlfred E. Mann Foundation for Scientific Research · 1994
- Multiple wavelength optical sensor770US 8,781,544 B2Cercacor Laboratories, Inc. · 2014
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000