H10W 72/5475
Multiple bond wires connected to common bond pads at both ends of
Official title: {multiple bond wires connected to common bond pads at both ends of the wires}
H10W72/5475 (Multiple bond wires connected to common bond pads at both ends of) appears on 2,045 US grants and 2,182 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,045
- Published applications
- 2,182
- Assignees
- 471
- Inventors
- 3,399
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 13 | 0 |
| 1996 | 22 | 0 |
| 1997 | 17 | 0 |
| 1998 | 14 | 0 |
| 1999 | 24 | 0 |
| 2000 | 24 | 0 |
| 2001 | 31 | 20 |
| 2002 | 46 | 67 |
| 2003 | 40 | 63 |
| 2004 | 56 | 58 |
| 2005 | 48 | 85 |
| 2006 | 59 | 88 |
| 2007 | 37 | 66 |
| 2008 | 44 | 68 |
| 2009 | 51 | 85 |
| 2010 | 70 | 66 |
| 2011 | 68 | 105 |
| 2012 | 79 | 100 |
| 2013 | 94 | 78 |
| 2014 | 86 | 100 |
| 2015 | 83 | 105 |
| 2016 | 93 | 96 |
| 2017 | 105 | 108 |
| 2018 | 90 | 88 |
| 2019 | 106 | 96 |
| 2020 | 90 | 127 |
| 2021 | 85 | 124 |
| 2022 | 100 | 143 |
| 2023 | 90 | 112 |
| 2024 | 111 | 67 |
| 2025 | 80 | 42 |
| 2026 | 37 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Methods and systems for component analysis, sorting, and sequencing based on component parameters and devices utilizing the methods and systems25 Aug 2026US 12,721,110 B2Wolfspeed, Inc.
- Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor25 Aug 2026US 12,721,186 B2Infineon Technologies Austria AG
- Semiconductor device25 Aug 2026US 12,721,209 B2Rohm Co., Ltd.
- Transistor device, semiconductor package and method of fabricating a transistor device18 Aug 2026US 12,713,671 B2Infineon Technologies Austria AG
- Power module for solid-state circuit breaker6 Aug 2026US 2026/0231762 A1Zapadoceska Univerzita V Plzni
- Electronic Assembly, Electronic Device, and Preparation Method for Electronic Assembly6 Aug 2026US 2026/0231809 A1Huawei Technologies Co., Ltd.
- Semiconductor device30 Jul 2026US 2026/0223719 A1Sumitomo Electric Device Innovations, Inc.
- Semiconductor module30 Jul 2026US 2026/0223743 A1Rohm Co., Ltd.
- Semiconductor apparatus16 Jul 2026US 2026/0206658 A1Rohm Co., Ltd.
Most cited
By later US patents
- Microwave IC package307US 5,294,897 AMitsubishi Denki Kabushiki Kaisha · 1994
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999
- Semiconductor device and method for manufacturing the same266US 6,307,272 B1Hitachi, Ltd. · 2001
- Vertical power mosfet having thick metal layer to reduce distributed resistance258US 5,665,996 ASiliconix Incorporated · 1997