H10W 72/5473
Multiple bond wires connected to a common bond pad
Official title: {multiple bond wires connected to a common bond pad}
H10W72/5473 (Multiple bond wires connected to a common bond pad) appears on 2,675 US grants and 2,715 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,675
- Published applications
- 2,715
- Assignees
- 627
- Inventors
- 4,600
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 8 | 0 |
| 1991 | 11 | 0 |
| 1992 | 30 | 0 |
| 1993 | 11 | 0 |
| 1994 | 24 | 0 |
| 1995 | 28 | 0 |
| 1996 | 30 | 0 |
| 1997 | 28 | 0 |
| 1998 | 38 | 0 |
| 1999 | 38 | 0 |
| 2000 | 37 | 0 |
| 2001 | 41 | 20 |
| 2002 | 53 | 76 |
| 2003 | 74 | 97 |
| 2004 | 67 | 83 |
| 2005 | 64 | 105 |
| 2006 | 85 | 96 |
| 2007 | 70 | 129 |
| 2008 | 62 | 138 |
| 2009 | 82 | 141 |
| 2010 | 112 | 129 |
| 2011 | 128 | 125 |
| 2012 | 119 | 118 |
| 2013 | 109 | 116 |
| 2014 | 129 | 109 |
| 2015 | 115 | 140 |
| 2016 | 120 | 120 |
| 2017 | 128 | 125 |
| 2018 | 113 | 108 |
| 2019 | 109 | 105 |
| 2020 | 99 | 130 |
| 2021 | 96 | 107 |
| 2022 | 100 | 133 |
| 2023 | 77 | 110 |
| 2024 | 103 | 75 |
| 2025 | 76 | 47 |
| 2026 | 39 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
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