Semiconductor package having memory devices stacked in staircase

A semiconductor package, comprising:

• a substrate including signal bond fingers disposed adjacent to a first side, and first power bond fingers and second power bond fingers disposed adjacent to a second side;
• a master memory chip stacked over the substrate;
• and
• a lower slave memory chip stacked over the master memory chip,
• wherein the master memory chip includes:
• master external pads;
• master internal pads;
• and
• master power pads electrically connected to the first power bond fingers,
• wherein the lower slave memory chip includes:
• lower slave external pads;
• lower slave internal pads;
• and
• lower slave power pads electrically connected to the second power bond fingers,
• wherein:
• the master external pads and the master internal pads are disposed adjacent to a first side edge of the master memory chip in a side-by-side,
• the lower slave external pads and the lower slave internal pads are disposed adjacent to a first side edge of the lower slave memory chip in a side-by-side,
• the signal bond fingers are electrically connected to the master external pads through external bonding wires, respectively,
• the master internal pads are electrically connected to the lower slave internal pads through lower internal bonding wires, respectively, and
• the master external pads and the lower slave external pads are not connected through the bonding wires.

A semiconductor package comprising:

• a substrate having a bond finger;
• a master memory chip mounted over the substrate, the master memory chip including a master external pad and a master internal pad;
• a first slave memory chip stacked over the master memory chip, the first slave memory chip including a first slave external pad and a first slave internal pad;
• and
• a second slave memory chip stacked over the first slave memory chip, the second slave memory chip including a second slave external pad and a second slave internal pad wherein:
• the bond finger is electrically connected to the master external pad through an external bonding wire,
• the master internal pad is electrically connected to the first slave internal pad through first internal bonding wire,
• the first slave internal pad are electrically connected to the second slave internal pad through second internal bonding wire, and
• the first slave external pad and the second slave external pad are floating.