Semiconductor devices with selectively disabled bond pads for cascade wire bonding

Abstract

Semiconductor devices with selectively disabled bond pads for cascade wire bonding (and associated systems, devices, and methods) are disclosed herein. In one embodiment, a semiconductor device includes a substrate having a bond finger, a stack of semiconductor dies disposed on the substrate, and a cascaded wire bond. The stack can include a first semiconductor die and a second semiconductor die disposed over the first semiconductor die. The first semiconductor die can include a dummy pad, and the second semiconductor die can include a bond pad. The cascaded wire bond can couple the bond pad to the bond finger via the dummy pad. The semiconductor device can further include circuitry configured to convert a bond pad of the first semiconductor die into the dummy pad.

Dependencies are inferred from the claim text.