H10W 72/543
Of outermost layers of multilayered bond wires
Official title: {of outermost layers of multilayered bond wires, e.g. coating being only on a part of a core}
H10W72/543 (Of outermost layers of multilayered bond wires) appears on 70 US grants and 50 published applications in this corpus.
Search patents in H10W- Granted patents
- 70
- Published applications
- 50
- Assignees
- 43
- Inventors
- 107
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 0 |
| 2002 | 2 | 4 |
| 2003 | 4 | 1 |
| 2004 | 1 | 3 |
| 2005 | 2 | 3 |
| 2006 | 2 | 1 |
| 2007 | 1 | 5 |
| 2008 | 0 | 3 |
| 2009 | 0 | 3 |
| 2010 | 4 | 5 |
| 2011 | 5 | 3 |
| 2012 | 4 | 2 |
| 2013 | 2 | 0 |
| 2014 | 0 | 2 |
| 2015 | 1 | 2 |
| 2016 | 2 | 4 |
| 2017 | 2 | 2 |
| 2018 | 4 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 1 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device including bonding covers19 Aug 2025US 12,394,745 B2Semiconductor Components Industries, LLC
- Semiconductor device having controller with graphite sheet17 Oct 2023US 11,791,234 B2Kioxia Corporation
- Method for forming ball in bonding wire6 Nov 2018US 10,121,764 B2Nippon Micrometal Corporation
- Metal post bonding using pre-fabricated metal posts24 Jul 2018US 10,034,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Coated bond wires for die packages and methods of manufacturing said coated bond wires12 Jun 2018US 9,997,489 B2Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Semiconductor package and manufacturing method thereof30 Apr 2026US 2026/0123537 A1SK hynix Inc.
- Semiconductor apparatus and method for manufacturing the same, and power conversion apparatus12 Jun 2025US 2025/0192098 A1Mitsubishi Electric Corporation
- Bonded connection means21 Mar 2024US 2024/0096844 A1Siemens Aktiengesellschaft
- Semiconductor device including bonding covers26 Oct 2023US 2023/0343739 A1Semiconductor Components Industries, LLC
- Semiconductor device, power conversion device, and method for manufacturing semiconductor device20 Oct 2022US 2022/0336402 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001
- Method of making contact tip structures184US 5,864,946 AForm Factor, Inc. · 1999
- Wafer-level test and burn-in, and semiconductor process171US 6,032,356 AFormFactor, Inc. · 2000