Coated bond wires for die packages and methods of manufacturing said coated bond wires
AssigneeRosenberger Hochfrequenztechnik GmbH & Co. KG
InventorsSean S. Cahill, Eric A. Sanjuan
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Abstract
A bond wire having a metal core, a dielectric layer, and a ground connectable metallization, wherein the bond wire has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one bond wire according to the invention.
Claims8
A lead having a metal core, a dielectric layer at least partially surrounding the metal core, the dielectric being only partially surrounded by a ground connectable metal coating, wherein the lead further has at least one vapor barrier coating protecting areas that are not covered by metal.
A die package comprising
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- and
- one or more leads according to any of the preceding claims connected between the die and the die substrate.
A lead having a metal core, a dielectric layer at least partially surrounding the metal core, the dielectric being only partially surrounded by a ground connectable metal coating, wherein the lead further has at least one vapor barrier coating covering areas that are not covered by metal.
Dependencies are inferred from the claim text.