Method for forming ball in bonding wire
AssigneesNippon Micrometal Corporation, Nippon Steel & Sumikin Materials Co., Ltd.
InventorsNoritoshi Araki, Takashi Yamada, Teruo Haibara, Ryo Oishi, Tomohiro Uno
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Abstract
The present invention provides a ball forming method for forming a ball portion at a tip of a bonding wire which includes a core material mainly composed of Cu, and a coating layer mainly composed of Pd and formed over a surface of the core material, wherein the ball portion is formed in non-oxidizing atmosphere gas including hydrocarbon which is gas at room temperature and atmospheric pressure, the method being capable of improving Pd coverage on a ball surface in forming a ball at a tip of the Pd-coated Cu bonding wire.
Claims11
A ball forming method for forming a ball portion at a tip of a bonding wire which includes a core material including Cu with a concentration of 50 at % or above, and a coating layer including Pd with a concentration of 50 at % or above and formed over a surface of the core material, the ball forming method comprising a step of forming the ball portion by heating with an arc discharge in non-oxidizing atmosphere gas including hydrocarbon which is gas at room temperature and atmospheric pressure.
Dependencies are inferred from the claim text.