Metal post bonding using pre-fabricated metal posts
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu
Estimating the term…
A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
A method comprising:
A method comprising:
A method comprising:
Dependencies are inferred from the claim text.