FormFactor, Inc.
Livermore, CA, US· latest recorded location
FormFactor, Inc. is named on 499 US grants and 192 published applications in this corpus. Its most frequent classification is G01R (Measuring electric variables).
- Granted patents
- 499
- Published applications
- 192
- Inventors
- 220
- Granted in 2026 so far
- 3
- Most recent grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 15 | 10 |
| 2002 | 19 | 12 |
| 2003 | 31 | 13 |
| 2004 | 39 | 8 |
| 2005 | 31 | 8 |
| 2006 | 36 | 14 |
| 2007 | 40 | 10 |
| 2008 | 32 | 12 |
| 2009 | 40 | 15 |
| 2010 | 51 | 12 |
| 2011 | 36 | 5 |
| 2012 | 22 | 7 |
| 2013 | 16 | 8 |
| 2014 | 11 | 6 |
| 2015 | 6 | 3 |
| 2016 | 5 | 0 |
| 2017 | 3 | 2 |
| 2018 | 4 | 3 |
| 2019 | 3 | 5 |
| 2020 | 3 | 1 |
| 2021 | 8 | 5 |
| 2022 | 7 | 3 |
| 2023 | 4 | 5 |
| 2024 | 4 | 7 |
| 2025 | 6 | 11 |
| 2026 | 3 | 7 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 691 documents
- G01RMeasuring electric variables585
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by205
- Y10TTechnical subjects covered by former us classification179
- H05KPrinted circuits176
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered117
- H01RElectrically-conductive connections93
- B23KSoldering or unsoldering72
- Y02PLow-carbon manufacturing65
- C25DProcesses for the electrolytic or electrophoretic production of coatings57
- C23CCoating metallic material25
Recent patents
- Probe systems and methods of operating probe systems8 Sep 2026US 12,730,143 B2
- Abbreviated loopback attenuation18 Aug 2026US 12,710,450 B2
- Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions18 Aug 2026US 12,712,282 B2
- Remote control devices for probe systems, probe systems that include the remote control devices, and methods of remotely operating a motorized positioner of a probe system21 Oct 2025US 12,449,445 B2
- Vertical probe array having sliding contacts in elastic guide plate14 Oct 2025US 12,442,834 B2
- Vibration isolation layers, measurement systems that include the vibration isolation layers, and related methods24 Sep 2026US 2026/0287616 A9
- Probe card with calibrated probe head capacitive distance monitor11 Jun 2026US 2026/0160809 A1
- Advanced Complex Impedance Matching Capabilities for On–Wafer Antenna Transceiver Measurements7 May 2026US 2026/0126487 A1
- Direct Connectorization for High-Frequency Signals26 Mar 2026US 2026/0086118 A1
- Probe supports, probe assemblies that include the probe supports, probe systems that include the probe assemblies, and related methods5 Mar 2026US 2026/0063481 A1
Most cited
By later US patents
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 A1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 A1999
- Fabricating interconnects and tips using sacrificial substrates321US 5,994,152 A1999
- Contact carriers (tiles) for populating larger substrates with spring contacts304US 5,806,181 A1998
- Wafer-level burn-in and test278US 6,064,213 A2000