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US 2026/0126487 A1Published application
Advanced Complex Impedance Matching Capabilities for On–Wafer Antenna Transceiver Measurements
AssigneeFormFactor, Inc.
InventorsPratik Bakul Ghate, Ryan Garrison, Jiexia Shi
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Abstract
Improved probing of devices under test that have an impedance mismatch to the test equipment is provided. The probes are connected to the test equipment via a flexible circuit, and the impedance matching is done using lumped elements in the flexible circuit. Such lumped elements can be integral to transmission lines in the flexible circuit.
Claims12
A probe head for making temporary electrical contact to a device under test, the probe head comprising:
- an array of probes;
- and
- a flexible circuit including at least one impedance matching structure configured to provide an impedance match between a test equipment (TE) impedance and a device under test (DUT) impedance;
- wherein the array of probes is disposed on the flexible circuit;
- wherein at least one probe of the probe array is connected to the impedance matching structure such that the probe is configured to probe a device under test at the DUT impedance;
- wherein the impedance matching structure includes at least one lumped element.
3 more elements
Dependencies are inferred from the claim text.