US 2022/0336402 A1 · SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Abstract

A semiconductor device includes a semiconductor element, at least one first resin member, and at least one conducting wire. The semiconductor element includes a front electrode and a body part. The at least one first resin member is disposed on a second surface of the front electrode. The at least one conducting wire includes a joining part. The at least one first resin member includes a convex part. The convex part protrudes from the front electrode in a direction away from the body part. The at least one conducting wire includes a concave part. The concave part is adjacent to the joining part. The concave part extends along the convex part. The concave part is fitted to the convex part.

Claims16

Dependent claims

A semiconductor device comprising:

a semiconductor element including a body part and a front electrode having a first surface bonded to the body part and a second surface on an opposite side of the first surface;
at least one first resin member disposed on the second surface of the front electrode;
and
at least one conducting wire including a joining part adjacent to the at least one first resin member and bonded to the second surface, wherein
the at least one first resin member includes a convex part protruding from the front electrode in a direction away from the body part,
the at least one conducting wire includes a concave part adjacent to the joining part and extending along the convex part, and
the concave part is fitted to the convex part.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor device, power conversion device, and method for manufacturing semiconductor device

Life of this patent

Semiconductor device, power conversion device, and method for manufacturing semiconductor device

Life of this patent

Abstract

Claims16