Semiconductor device having controller with graphite sheet
AssigneeKioxia Corporation
InventorsRyo Kamoda, Hideki Takahashi
Life of this patent
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Abstract
A semiconductor device includes a substrate that has a first surface and a second surface on which a plurality of solder balls are provided, a semiconductor memory on the first surface of the substrate, a controller arranged on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory, a graphite sheet extending along the first direction above the controller and the semiconductor memory, and a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet.
Claims20
A semiconductor device, comprising:
- a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;
- a semiconductor memory on the first surface of the substrate;
- a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;
- a graphite sheet extending along the first direction above the controller and the semiconductor memory;
- a first heat conductive plate between the controller and the graphite sheet;
- an insulating sheet between the graphite sheet and the first heat conductive plate;
- a first bonding wire connected to the controller;
- an insulating film between the controller and the first heat conductive plate;
- and
- a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet, wherein
- at least a part of the first bonding wire is between the controller and the first heat conductive plate.
A semiconductor device, comprising:
- a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;
- a semiconductor memory on the first surface of the substrate;
- a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;
- a first heat conductive plate above the controller;
- a sealing material that seals the semiconductor memory, the controller, and the first heat conductive plate;
- a first bonding wire connected to the controller;
- and
- an insulating film between the controller and the first heat conductive plate, wherein
- at least a part of the first bonding wire is between the controller and the first heat conductive plate.
A semiconductor device, comprising:
- a substrate that has a first surface and a second surface on which a plurality of solder balls are provided;
- a semiconductor memory on the first surface of the substrate;
- a controller on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory;
- a graphite sheet extending along the first direction above the controller and the semiconductor memory;
- and
- a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet, wherein
- a surface area of the graphite sheet is smaller than an area of a surface of the first sealing material that extends along the surface of the graphite sheet.
Dependencies are inferred from the claim text.