H10W 72/5453
Connecting between multiple bond pads on a chip
Official title: {connecting between multiple bond pads on a chip, e.g. daisy chain}
H10W72/5453 (Connecting between multiple bond pads on a chip) appears on 650 US grants and 689 published applications in this corpus.
Search patents in H10W- Granted patents
- 650
- Published applications
- 689
- Assignees
- 275
- Inventors
- 1,273
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 7 | 0 |
| 1998 | 11 | 0 |
| 1999 | 4 | 0 |
| 2000 | 14 | 0 |
| 2001 | 10 | 5 |
| 2002 | 12 | 16 |
| 2003 | 21 | 13 |
| 2004 | 20 | 23 |
| 2005 | 14 | 22 |
| 2006 | 11 | 27 |
| 2007 | 25 | 38 |
| 2008 | 12 | 37 |
| 2009 | 18 | 36 |
| 2010 | 35 | 34 |
| 2011 | 38 | 29 |
| 2012 | 21 | 29 |
| 2013 | 38 | 32 |
| 2014 | 20 | 34 |
| 2015 | 29 | 31 |
| 2016 | 24 | 33 |
| 2017 | 35 | 38 |
| 2018 | 33 | 29 |
| 2019 | 36 | 26 |
| 2020 | 25 | 35 |
| 2021 | 23 | 31 |
| 2022 | 27 | 32 |
| 2023 | 17 | 13 |
| 2024 | 18 | 24 |
| 2025 | 11 | 12 |
| 2026 | 13 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Radio frequency identification tag368US 5,682,143 AInternational Business Machines Corporation · 1997
- Multichip module having a stacked chip arrangement358US 5,323,060 AMicron Semiconductor, Inc. · 1994
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Thin radio frequency transponder with leadframe antenna structure290US 5,786,626 AIBM Corporation · 1998