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US 12,740,432 B2Granted
Memory device package having scribe line and method for manufacturing the same
AssigneeNanya Technology Corporation
InventorWu-Der Yang
Life of this patent
Estimating the term…
Abstract
A memory device package and a method of manufacturing a memory device package. The memory device package includes a substrate having a first chip region, a second chip region, and a first scribe line region connected between the first chip region and the second chip region. The memory device package also includes a first memory chip disposed over the first chip region and a second memory chip disposed over the second chip region.
Claims16
A memory device package, comprising:
- a carrier having a conductive pad;
- a substrate, disposed over the carrier, having a first chip region, a second chip region, and a first scribe line region connected between the first chip region and the second chip region, wherein the first scribe line region is a non-scribed region maintained in the memory device package;
- a first memory chip disposed over the first chip region, having a plurality of first conductive pads arranged in a first line, wherein the plurality of first conductive pads are positioned such that a distance between each first conductive pad and a first side of the first memory chip is less than a distance between each first conductive pad and a second side of the first memory chip, wherein the first side of the first memory chip faces the conductive pad, and the second side of the first memory chip faces a second memory chip;
- the second memory chip disposed over the second chip region, having a plurality of second conductive pads arranged in a second line, wherein the plurality of second conductive pads are positioned such that a distance between each second conductive pad and a first side of the second memory chip is less than a distance between each second conductive pad and a second side of the second memory chip, wherein the first side of the second memory chip faces the first memory chip;
- and
- guard rings embedded in the substrate and disposed across a boundary between the first chip region and the first scribe line region,
- wherein one of the plurality of first conductive pads is electrically connected to the conductive pad through a first conductive wire, and another one of the plurality of first conductive pads is electrically connected to one of the plurality of second conductive pads through a second conductive wire.
4 more elements
A memory device package, comprising:
- a carrier having a conductive pad;
- a substrate, disposed over the carrier, having a first scribe line region, wherein the first scribe line region is a non-scribed region maintained in the memory device package;
- a first memory chip disposed over the substrate, having a plurality of first conductive pads arranged in a first line, wherein the plurality of first conductive pads are positioned such that a distance between each first conductive pad and a first side of the first memory chip is less than a distance between each first conductive pad and a second side of the first memory chip, wherein the first side of the first memory chip faces the conductive pad;
- a second memory chip disposed over the substrate, having a plurality of second conductive pads arranged in a second line, wherein the plurality of second conductive pads are positioned such that a distance between each second conductive pad and a first side of the second memory chip is less than a distance between each second conductive pad and a second side of the second memory chip, wherein the first side of the second memory chip faces the second side of the first memory chip, wherein the second memory chip is electrically connected with first memory chip through a circuit layer extending across the first scribe line region;
- and
- guard rings embedded in the substrate and disposed across a boundary between the first memory chip and the first scribe line region,
- wherein one of the plurality of first conductive pads is electrically connected to the conductive pad through a first conductive wire, and another one of the plurality of first conductive pads is electrically connected to one of the plurality of second conductive pads through a second conductive wire.
4 more elements
Dependencies are inferred from the claim text.