NAND die with wire-bond inductive compensation for altered bond wire bandwidth in memory devices
AssigneeSanDisk Technologies LLC
InventorsJohn Contreras, Nagesh Vodrahalli, Md. Sayed Mobin
Life of this patent
Estimating the term…
Abstract
A storage device includes a substrate of a memory package that includes a first pin pad, a controller mounted on the substrate and electrically connected to the first pin pad, the controller being configured to manage data communications on a data channel, and a first memory die. The first memory die includes a front pin pad electrically connected to the first pin pad of the substrate by way of a first bond wire, a rear pin pad, a conductor segment electrically connecting the front pin pad and the rear pin pad of the first memory die, and a plurality of memory cells configured to provide non-volatile storage accessible by way of the data channel.
Claims20
A storage device, comprising:
- a substrate of a memory package that includes a pin pad;
- a controller mounted on the substrate and electrically connected to the pin pad, the controller operable to manage data communications on a data channel;
- and
- a memory die, comprising:
- a front pin pad electrically connected to the pin pad of the substrate by way of a bond wire;
- a rear pin pad;
- a conductor segment electrically connecting the front pin pad and the rear pin pad of the first memory die, wherein at least a portion of the conductor segment wraps at least partially around one or more of the front pin pad and the rear pin pad;
- and
- a plurality of memory cells providing non-volatile storage accessible by way of the data channel.
A memory die, comprising:
- a first pin pad;
- a second pin pad;
- and
- a conductor segment electrically connecting the first pin pad and the second pin pad by way of a single electrical circuit segment, the conductor segment being a conductor land formed onto a surface face of the memory die and at least partially surrounding at least one of the first pin pad and the second pin pad.
A storage device, comprising:
- a substrate of a memory package that includes means for electrically connecting a first pin pad of the memory package to a controller, thereby defining a data channel for data communications between at least the memory package and the controller;
- and
- a first memory die comprising:
- means for electrically connecting a front pin pad of the first memory die to the first pin pad of the substrate;
- and
- means for electrically connecting the front pin pad and a rear pin pad of the first memory die by way of a conductor segment, wherein at least a portion of the conductor segment wraps at least partially around one or more of the front pin pad and the rear pin pad.
Dependencies are inferred from the claim text.