Semiconductor package

A semiconductor package, comprising:

• a first redistribution structure comprising first redistribution conductive patterns;
• a connection structure disposed on the first redistribution structure, and electrically connected to the first redistribution structure;
• a first molded layer disposed on a side surface of the connection structure;
• and
• a second redistribution structure disposed on the connection structure and the first molded layer, and comprising second redistribution conductive patterns,
• wherein the connection structure comprises a plurality of conductive pattern structures stacked in a vertical direction, and
• each of the plurality of conductive patterns comprises:
• a first conductive pattern comprising a first conductive material;
• and
• a second conductive pattern disposed on the first conductive pattern, and comprising a second conductive material, different from the first conductive material, and
• each of the first conductive patterns has a side surface disposed inwardly of a side surface of the respective second conductive pattern.

A semiconductor package, comprising:

• a lower package;
• conductive bumps disposed on the lower package;
• and
• an upper package disposed on the conductive bumps,
• wherein the lower package comprises:
• a first redistribution structure comprising first redistribution conductive patterns, and having a lower surface on which lower pads connected to the first redistribution conductive patterns are disposed;
• lower pads disposed on the lower surface of the first redistribution structure;
• lower connection bumps disposed below the lower pads;
• a first semiconductor chip disposed on the first redistribution structure, and electrically connected to the first redistribution structure;
• a connection structure disposed on the first redistribution structure spaced apart from the first semiconductor chip in a horizontal direction, and electrically connected to the first redistribution structure;
• and
• a second redistribution structure disposed on the connection structure, and comprising second redistribution conductive patterns, and
• the connection structure comprises:
• first conductive patterns comprising a first conductive material;
• and
• second conductive patterns comprising a second conductive material, different from the first conductive material, and alternately disposed with the first conductive patterns in a vertical direction intersecting the horizontal direction, and
• each of the second conductive patterns has a side surface protruding in the horizontal direction from a side surface of the respective first conductive pattern.