H10W 72/521
Structures or relative sizes of bond wires
Official title: {Structures or relative sizes of bond wires}
H10W72/521 (Structures or relative sizes of bond wires) appears on 1,963 US grants and 2,131 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,963
- Published applications
- 2,131
- Assignees
- 516
- Inventors
- 3,380
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 3 | 0 |
| 1991 | 12 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 14 | 0 |
| 1996 | 12 | 0 |
| 1997 | 18 | 0 |
| 1998 | 25 | 0 |
| 1999 | 23 | 0 |
| 2000 | 43 | 0 |
| 2001 | 34 | 17 |
| 2002 | 29 | 42 |
| 2003 | 29 | 51 |
| 2004 | 46 | 49 |
| 2005 | 36 | 61 |
| 2006 | 43 | 73 |
| 2007 | 33 | 79 |
| 2008 | 43 | 79 |
| 2009 | 49 | 73 |
| 2010 | 65 | 79 |
| 2011 | 62 | 62 |
| 2012 | 76 | 96 |
| 2013 | 78 | 106 |
| 2014 | 94 | 121 |
| 2015 | 95 | 109 |
| 2016 | 114 | 95 |
| 2017 | 106 | 129 |
| 2018 | 110 | 99 |
| 2019 | 95 | 83 |
| 2020 | 85 | 90 |
| 2021 | 60 | 87 |
| 2022 | 82 | 108 |
| 2023 | 63 | 120 |
| 2024 | 84 | 100 |
| 2025 | 85 | 74 |
| 2026 | 58 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Power semiconductor device and manufacturing method8 Sep 2026US 12,733,493 B2Hitachi Energy Ltd
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement8 Sep 2026US 12,733,550 B2Audi AG
- Semiconductor package25 Aug 2026US 12,720,773 B2Samsung Electronics Co., Ltd.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Power module package with molded via and dual side press-fit pin1 Oct 2026US 2026/0305495 A1Semiconductor Components Industries, LLC
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Nanowires, nanostructures and devices fabricated therefrom394US 6,882,051 B2The Regents of the University of California · 2005