H10W 72/528
Multiple bond wires having different structures
Official title: {Multiple bond wires having different structures}
H10W72/528 (Multiple bond wires having different structures) appears on 9 US grants and 12 published applications in this corpus.
Search patents in H10W- Granted patents
- 9
- Published applications
- 12
- Assignees
- 9
- Inventors
- 29
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 1 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 1 |
| 2023 | 2 | 2 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor apparatus20 May 2025US 12,308,349 B2Mitsubishi Electric Corporation
- Semiconductor device5 Nov 2024US 12,136,589 B2Rohm Co., Ltd.
- Multi-die, vertical-wire package-in-package apparatus, and methods of making same5 Sep 2023US 11,749,653 B2Intel Corporation
- Power module and method of manufacturing the same, and power conversion apparatus24 Jan 2023US 11,562,979 B2Mitsubishi Electric Corporation
- Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires22 Feb 2022US 11,257,780 B2Mediatek Inc.
- Semiconductor device30 Jul 2026US 2026/0223718 A1Rohm Co., Ltd.
- Power Semiconductor Device Package21 May 2026US 2026/0144143 A1Wolfspeed, Inc.
- Semiconductor device23 Nov 2023US 2023/0378018 A1Rohm Co., Ltd.
- Semiconductor apparatus6 Apr 2023US 2023/0108305 A1Mitsubishi Electric Corporation
- Semiconductor device3 Mar 2022US 2022/0068776 A1Rohm Co., Ltd.
Most cited
By later US patents
- Semiconductor device package and method of manufacturing the same7US 10,629,519 B2Advanced Semiconductor Engineering, Inc. · 2020
- Semiconductor device6US 10,163,791 B2Renesas Electronics Corporation · 2018
- Stackable electrically-isolated diode-laser bar assembly3US 10,297,980 B2Coherent, Inc. · 2019
- Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires1US 10,847,488 B2Mediatek Inc. · 2020