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US 10,629,519 B2Granted
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes an electronic device, a conductive frame and a first molding layer. The conductive frame is disposed over and electrically connected to the electronic device, and the conductive frame includes a plurality of leads. The first molding layer covers the electronic device and a portion of the conductive frame, and is disposed between at least two adjacent ones of the leads.
Claims22
A semiconductor device package, comprising:
- an electronic device;
- a conductive frame disposed on and electrically connected to the electronic device, the conductive frame comprising a plurality of leads;
- a first molding layer covering the electronic device and a portion of the conductive frame, and disposed between at least two adjacent ones of the leads;
- and
- a plurality of electrical contacts disposed over and electrically connected to the electronic device, wherein a portion of at least one of plurality of the plurality of electrical contacts protrudes from the first molding layer, and
- wherein at least one end of at least one of the plurality of leads is exposed from a lateral side of the first molding layer.
3 more elements
A semiconductor device package, comprising:
- an electronic device having a first surface, a second surface opposite to the first surface, and a plurality of lateral sides;
- a conductive frame comprising a cap portion facing the first surface of the electronic device, and a lateral portion surrounding the lateral sides of the electronic device, the lateral portion defining at least one notch, and the conductive frame being electrically connected to the electronic device;
- a first molding layer encapsulating the lateral sides and a portion of the second surface of the electronic device, the lateral portion of the conductive frame, and a portion of the cap portion, and filled into the at least one notch;
- and
- a plurality of electrical contacts disposed over and electrically connected to the second surface of the electronic device, wherein a portion of at least one of the plurality of electrical contacts protrudes from the first molding layer,
- wherein a portion of the lateral portion of the conductive frame is exposed from a lateral side of the first molding layer.
3 more elements
A semiconductor device package, comprising:
- an electronic device;
- a conductive frame disposed over and electrically connected to the electronic device, the conductive frame comprising a plurality of leads;
- a first molding layer covering the electronic device and a portion of the conductive frame;
- a grounding component electrically connected to the electronic device;
- a bonding wire encapsulated by the first molding layer, wherein the conductive frame is electrically connected to the grounding component through the bonding wire;
- and
- a plurality of electrical contacts disposed over and electrically connected to the electronic device, wherein a portion of at least one of the plurality of electrical contacts protrudes from the first molding layer.
4 more elements
Dependencies are inferred from the claim text.