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US 11,257,780 B2Granted
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
AssigneeMediatek Inc.
InventorShiann-Tsong Tsai
Life of this patent
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Abstract
A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting an active surface of the semiconductor die to the top surface of the carrier substrate, an insulating material encapsulating the plurality of bonding wires, a component mounted on the insulating material, and a molding compound covering the top surface of the carrier substrate and encapsulating the semiconductor die, the plurality of bonding wires, the component and the insulating material.
Claims15
A semiconductor package, comprising:
- a carrier substrate having a top surface;
- a semiconductor die mounted over the top surface;
- a first plurality of bonding wires connected to the top surface;
- a second plurality of bonding wires connected to the top surface;
- a first insulating material encapsulating the first plurality of bonding wires;
- a second insulating material encapsulating the second plurality of bonding wires;
- a first component mounted on the first insulating material;
- and
- a second component mounted on the second insulating material.
6 more elements
Dependencies are inferred from the claim text.