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US 11,749,653 B2Granted
Multi-die, vertical-wire package-in-package apparatus, and methods of making same
AssigneeIntel Corporation
InventorsHyoung Il Kim, Florence R. Pon, Yi Elyn Xu
Life of this patent
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Abstract
A vertical-wire package-in-package includes at least two memory-die stacks that form respective memory modules that are stacked vertically on a bond-wire board. Each memory die in the memory-die stack includes a vertical bond wire that emerges from a matrix for connection. The matrix encloses the memory-die stack, the spacer, and a redistribution layer. At least two memory modules are assembled in a vertical-wire package-in-package.
Claims12
A package-in-package apparatus comprising:
- a first memory module coupled to a bond-wire board through a first vertical bond wire, a first redistribution layer and a first curved wire bond, wherein the first vertical bond wire includes a wire bond bead at a first end, and emerges from a first matrix at a second end;
- a subsequent memory module disposed above the first memory module and coupled to the bond-wire board through a subsequent vertical bond wire, a subsequent redistribution layer and a subsequent curved wire bond, wherein the subsequent vertical bond wire emerges from a subsequent matrix;
- and
- an encapsulation that covers the first and subsequent memory modules, the first and subsequent curved wire bonds, and a module side of the bond-wire board.
1 more element
A computing system, comprising:
- a first memory module coupled to a bond-wire board through a first vertical bond wire, a first redistribution layer and a first curved wire bond, wherein the first vertical bond wire includes a wire bond bead at a first end, and emerges from a first matrix at a second end;
- a second memory module stacked on the first memory module and coupled to the bond-wire board through a second vertical bond wire, a second redistribution layer and a second curved wire bond, wherein the second vertical bond wire emerges from a second matrix;
- a third memory module stacked below the subsequent memory module and coupled to the bond-wire board through a third vertical bond wire, a third redistribution layer and a third curved wire bond, wherein the third vertical bond wire emerges from a third matrix;
- a subsequent memory module coupled to the bond-wire board through a subsequent vertical bond wire, a subsequent redistribution layer and a subsequent curved wire bond, wherein the subsequent vertical bond wire emerges from a subsequent matrix;
- an encapsulation that covers the first and subsequent memory modules, the first and subsequent curved wire bonds, and a module side of the bond-wire board;
- wherein the first and second memory modules are wire bonded with the first and second wire bonds, to a first edge of the bond-wire board, and wherein the third and subsequent memory modules are wire bonded with the third and subsequent curved wire bonds to an edge of the bond-wire board other than the first edge;
- and
- a board onto which the bond-wire board is mounted, wherein the board includes an external shell.
5 more elements
Dependencies are inferred from the claim text.