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US 2023/0378018 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorsHajime OKUDA, Yuto NISHIYAMA, Toru TAKUMA, Katsuaki YAMADA
Life of this patent
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Abstract
A semiconductor device includes: a substrate; a device region provided in the substrate; a terminal covering the device region in a plan view; a plurality of pseudo-bumps densely arranged on the terminal in a state of being opened from a wire; and at least one genuine bump arranged more sparsely than the plurality of the pseudo-bumps on the terminal in a state of being connected to the wire.
Claims20
A semiconductor device comprising:
- a substrate;
- a device region provided in the substrate;
- a terminal covering the device region in a plan view;
- a plurality of pseudo-bumps densely arranged on the terminal in a state of being opened from a wire;
- and
- at least one genuine bump arranged more sparsely than the plurality of pseudo-bumps on the terminal in a state of being connected to the wire.
3 more elements
A semiconductor device comprising:
- a substrate;
- a device region provided in the substrate;
- a terminal covering the device region in a plan view;
- a pseudo-bump arranged on the terminal in a state of being opened from a wire;
- and
- a genuine bump that is arranged on the terminal in a state of being connected to the wire and has a size smaller than a size of the pseudo-bump.
3 more elements
Dependencies are inferred from the claim text.