H10W 72/524
Bond wires having multiple distinct cores
Official title: {Bond wires having multiple distinct cores}
H10W72/524 (Bond wires having multiple distinct cores) appears on 6 US grants and 10 published applications in this corpus.
Search patents in H10W- Granted patents
- 6
- Published applications
- 10
- Assignees
- 12
- Inventors
- 34
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year.
Recent patents
- Temperature-stable composite of a stranded wire having a contact pad20 May 2025US 12,308,588 B2Yageo Nexensos GmbH
- Electronic device and method of fabricating an electronic device5 Sep 2017US 9,756,726 B2Infineon Technologies AG
- Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly17 Dec 2013US 8,611,101 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Bonding wire and bonded connection15 Jan 2008US 7,319,196 B2EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
- Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals26 Sep 2006US 7,113,002 B2Fujikura Ltd.
- Electronic modules having electrical connection elements in the form of wedge-wedge-bonded structures not consisting of solid metal material3 Jul 2025US 2025/0219008 A1Heraeus Electronics GmbH & Co. KG
- Temperature-stable composite of a stranded wire having a contact pad5 Oct 2023US 2023/0318207 A1Heraeus Nexensos GmbH
- Bonding Wire and Method for Manufacturing the Same27 Apr 2023US 2023/0125151 A1Nippon Telegraph and Telephone Corporation
- Wire with composite shield21 Feb 2019US 2019/0057796 A1The Charles Stark Draper Laboratory, Inc.
- Thermoelectric bonding for integrated circuits9 Aug 2018US 2018/0226322 A1Intel Corporation
Most cited
By later US patents
- Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals228US 7,113,002 B2Fujikura Ltd. · 2006
- Integrated circuit interconnect6US 6,794,760 B1Intel Corporation · 2004
- Bonding wire and bonded connection5US 7,319,196 B2EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · 2008
- Temperature-stable composite of a stranded wire having a contact pad1US 12,308,588 B2Yageo Nexensos GmbH · 2025
- Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly1US 8,611,101 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2013