Bonding Wire and Method for Manufacturing the Same
AssigneeNippon Telegraph and Telephone Corporation
InventorsToshiki Kishi, Kota Shikama
Life of this patent
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Abstract
A bonding wire includes a hollow member made of an insulator and mounted such as to bridge ICs formed with interconnects, such that a plurality of open ends is each closed by abutting on a surface of the interconnect that is a connection target, and a connection member made of a conductor, filling inside of the hollow member such as to bond to the surface of the interconnect at a location where the hollow member abuts on the surface of the interconnect.
Claims21
1-8. (canceled)
A bonding wire comprising:
- a hollow member comprising an insulator and mounted so as to bridge a plurality of integrated circuits each having an interconnect, wherein each of a plurality of open ends of the hollow member is closed by abutting on a surface of a respective interconnect;
- and
- a connection member comprising a conductor, wherein the connection member fills an interior of the hollow member to bond to the surface of the respective interconnect at a location where the hollow member abuts on the surface of the respective interconnect.
A method of manufacturing a bonding wire, the method comprising:
- mounting a hollow member comprising an insulator so as to bridge a plurality of integrated circuits each provided with an interconnect, wherein each of a plurality of open ends of the hollow member is closed by abutting on a surface of a respective interconnect;
- injecting a connection member comprising a conductor in a flowable state into the hollow member through an injection hole to contact the surface of the respective interconnect at a location where the hollow member abuts on the surface of the respective interconnect;
- and
- hardening the connection member.
A method of manufacturing a bonding wire, the method comprising:
- forming a hollow member comprising an insulator, the hollow member comprising a first open end, a second open end, an injection hole, and an air hole extending from an outer wall to an inner wall;
- mounting the hollow member to bridge a first integrated circuit provided with a first interconnect and a second integrated circuit provided with a second interconnect, wherein the first open end is closed by a first surface of the first interconnect and the second open end is closed by a second surface of the second interconnect;
- and
- injecting a connection member comprising a conductor in a flowable state into the hollow member through the injection hole to contact the first surface of the first interconnect at the first open end of the hollow member and to contact the second surface of the second interconnect at the second open end of the hollow member.
Dependencies are inferred from the claim text.