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US 9,756,726 B2Granted
Electronic device and method of fabricating an electronic device
AssigneeInfineon Technologies AG
InventorsAlexander Heinrich, Peter Scherl, Magdalena Hoier, Hans-Joerg Timme
Life of this patent
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Abstract
An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.
Claims15
An electronic device comprising:
- a semiconductor chip and a substrate;
- and
- a multi-stranded bonding wire connecting the semiconductor chip and the substrate;
- wherein the multi-stranded bonding wire comprises two or more strands directly connected with each other and twisted around each other, and
- wherein at a first end of the multi-stranded bonding wire the strands are melted together into a Free Air Ball which is deformed into a bond ball bonding the multi-stranded bonding wire on the semiconductor chip.
2 more elements
An electronic device, comprising:
- a semiconductor element and a substrate;
- and
- a multi-stranded bonding wire connected to the semiconductor element and the substrate;
- wherein the multi-stranded bonding wire comprises a non-circular cross-section,
- wherein the multi-stranded bonding wire comprises two or more strands, and
- wherein one out of each one of the two or more strands comprises an individual insulating coating that is arranged concentrically all around of the respective strand, the individual insulating coating having an equal thickness in a radial direction around a circumference of the respective strand, and wherein the multi-stranded bonding wire comprises a collective insulating coating such that the two or more strands are electrically connected to one another.
3 more elements
A method of fabricating electrical connections in an electronic device, comprising:
- providing a first substrate and a second substrate;
- providing a multi-stranded bonding wire;
- electrically connecting the first substrate and the second substrate using the multi-stranded bonding wire;
- wherein the multi-stranded bonding wire comprises two or more strands directly connected with each other, and
- wherein electrically connecting the first substrate and the second substrate comprises forming a Free Air Ball by melting the two or more strands at a first end of the multi-stranded bonding wire and bonding the Free Air Ball ultrasonically or thermosonically to the first substrate.
2 more elements
Dependencies are inferred from the claim text.