Bonding wire and bonded connection
AssigneeEUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
InventorsGuy LeFranc, Christof Klos
Life of this patent
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Abstract
A bonding wire (1) includes a matrix material (2) and a filler (3) embedded in this matrix material (2), the coefficient of thermal expansion of the filler (3) being lower than the coefficient of thermal expansion of the matrix material (2), and the filler (3) content by weight amounting to at least 25% of the weight of the bonding wire (1). Also, a bonded connection between a bonding wire and a substrate may use such a bonding wire.
Claims22
A single bonding wire comprising a matrix material and a filler embedded therein, wherein the coefficient of thermal expansion of the filler is lower than the coefficient of thermal expansion of the matrix material, and the filler content amounting to at least 25% of the weight of the single bonding wire.
A bonded connection between
- a bonding wire comprising a matrix material and a filler embedded therein, wherein the coefficient of thermal expansion of the filler is lower than the coefficient of thermal expansion of the matrix material, and the filler content amounting to at least 25% of the weight of the bonding wire, and
- a substrate.
Dependencies are inferred from the claim text.