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US 6,794,760 B1Granted
Integrated circuit interconnect
AssigneeIntel Corporation
InventorsEdward Jaeck, Ronald I. Spreitzer, Robert M. Nickerson, Lesley A. Polka
Life of this patent
Estimating the term…
Abstract
A system may include an integrated circuit die, a package, and an interconnect. The integrated circuit die may include a conductive die pad, the package may include a conductive package pad, and the interconnect may include two or more stranded wires. A first end of the interconnect is electrically coupled to the conductive die pad, and a second end of the interconnect is electrically coupled to the package pad.
Claims19
An apparatus comprising:
- an integrated circuit die comprising a conductive die pad;
- a package comprising a conductive package pad;
- and
- an interconnect comprising two or more stranded wires, a first end of the interconnect electrically coupled to the conductive die pad, and a second end of the interconnect electrically coupled to the package pad.
1 more element
An interconnect comprising:
- a first wire;
- and
- a second wire,
- a first end of the first wire and a first end of the second wire to bond to a conductive die pad of an integrated circuit die substantially simultaneously, and
- a second end of the first wire and a second end of the second wire to bond to a conductive package pad of an integrated circuit package substantially simultaneously.
2 more elements
A method comprising:
- bonding a first wire and a second wire to a conductive die pad of an integrated circuit die using a first bond;
- and
- bonding the first wire and the second wire to a conductive package pad of an integrated circuit package using a second bond.
A system comprising:
- an integrated circuit die comprising a conductive die pad;
- a package comprising a conductive package pad;
- an interconnect comprising two or more stranded wires, a first end of the interconnect electrically coupled to the conductive die pad, and a second end of the interconnect electrically coupled to the package pad;
- and
- a double data rate memory electrically coupled to the package.
2 more elements
Dependencies are inferred from the claim text.