Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

A method for fabricating an assembly of at least a first and second microelectronic chip with a wire element, comprising :

• providing the wire element including first and second electrically conducting wires each covered with an insulator,
• providing the at least first and second microelectronic chips, each microelectronic chip including a groove and at least one electrically conducting bump being arranged on a first side wall of the groove, and
• embedding the wire element in the groove of the at least first and second microelectronic chips wherein
• the wire element forms a strand,
• a longitudinal axis of the strand is substantially parallel to the longitudinal axis of the grooves,
• said strand is blocked in the grooves of the at least first and second microelectronic chips by pinching between the at least one electrically conducting bump and a second side wall of the groove opposite said bump.
• a bump of the first microelectronic chip electrically contacts the first electrically conducting wire of the strand,
• a bump of the second microelectronic chip electrically contacts the second electrically conducting wire of the strand, and
• the at least one bump of the first chip corresponds to the first electrically conducting wire, and the at least one bump of the second chip corresponds to the second electrically conducting wire such that each chip is connected to only one wire of the strand.

An assembly comprising:

• at least one microelectronic chip with a wire element, wherein
• the wire element is a strand including at least first and second different electrically conducting wires each covered with an insulator, the wire element being embedded in a groove of the microelectronic chip and having a longitudinal axis substantially parallel to the axis of the groove,
• the at least one microelectronic chip comprises at least two electrically conducting bump disposed in the groove, a first bump being in contact with a first electrically conducting wire of the strand, and a second bump being in contact with a second electrically conducting wire of the strand different from the first electrically conducting wire, and
• the first bump corresponds to the first electrically conducting wire, and the second bump corresponds to the second electrically conducting wire such that each wire is connected to only one bump of the at least one microelectronic chip.

A method for fabricating an assembly of at least one microelectronic chip with a wire element comprising:

• providing the wire element including first and second electrically conducting wires each covered with an insulator,
• providing the at least one microelectronic chip including a groove and at least two electrically conducting bumps arranged in the groove, and
• embedding the wire element in the groove of the at least one microelectronic chip, wherein
• the wire element forms a strand,
• a longitudinal axis of the strand is substantially parallel to the longitudinal axis of the grooves,
• said strand is blocked in the grooves of the at one microelectronic chip by pinching between each of the at least two electrically conducting bumps and a at least one side wall of the groove opposite said at least two electrically conducting bumps,
• a first bump of the at least two electrically conducting bumps electrically contacts the first electrically conducting wire of the strand,
• a second bump of the at least two electrically conducting bumps electrically contacts the second electrically conducting wire of the strand, and
• the first bump corresponds to the first electrically conducting wire, and the second bump corresponds to the second electrically conducting wire such that each wire is connected to only one bump of the at least one microelectronic chip.