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US 2018/0226322 A1Published application
Thermoelectric bonding for integrated circuits
AssigneeIntel Corporation
InventorsChwee Lin Choong, Pooi Kit Lam
Life of this patent
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Abstract
Techniques for thermal management of an integrated circuit die are provided. In an example, an apparatus can include a first integrated circuit die having a thermal bond pad and a plurality of active components and a pair of thermoelectric bond wires. The thermal bond pad can be electrically isolated from the plurality of active components and the pair of thermoelectric bond wires can be coupled to the thermal bond pad at a bond location.
Claims21
An apparatus comprising:
- a first integrated circuit die including a thermal bond pad and a plurality of active components;
- a pair of thermoelectric bond wires;
- wherein the thermal bond pad is electrically isolated from the plurality of active components;
- and
- wherein the pair of thermoelectric bond wires are coupled to the thermal bond pad at a bond location.
2 more elements
A method for managing thermal energy of an integrated circuit die, the method comprising:
- activating the active circuits of the integrated circuit die;
- applying a voltage to a thermoelectric circuit having a thermal bond pad mechanically coupled to the integrated circuit die and a pair of thermoelectric bond wires;
- thermoelectrically transferring thermal energy of the integrated circuit die using a pair of thermoelectric bond wires coupled to the thermal bond pad in response to the applied voltage.
Dependencies are inferred from the claim text.