H10W 72/522
Multilayered bond wires
Official title: {Multilayered bond wires, e.g. having a coating concentric around a core}
H10W72/522 (Multilayered bond wires) appears on 750 US grants and 735 published applications in this corpus.
Search patents in H10W- Granted patents
- 750
- Published applications
- 735
- Assignees
- 254
- Inventors
- 1,349
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 9 | 0 |
| 1998 | 16 | 0 |
| 1999 | 17 | 0 |
| 2000 | 33 | 0 |
| 2001 | 22 | 8 |
| 2002 | 13 | 20 |
| 2003 | 16 | 24 |
| 2004 | 21 | 27 |
| 2005 | 17 | 23 |
| 2006 | 21 | 28 |
| 2007 | 12 | 35 |
| 2008 | 12 | 24 |
| 2009 | 12 | 30 |
| 2010 | 26 | 33 |
| 2011 | 22 | 25 |
| 2012 | 28 | 33 |
| 2013 | 23 | 40 |
| 2014 | 35 | 43 |
| 2015 | 32 | 43 |
| 2016 | 41 | 36 |
| 2017 | 37 | 49 |
| 2018 | 45 | 37 |
| 2019 | 34 | 35 |
| 2020 | 29 | 21 |
| 2021 | 16 | 25 |
| 2022 | 26 | 29 |
| 2023 | 23 | 23 |
| 2024 | 23 | 23 |
| 2025 | 17 | 13 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Semiconductor device with wire including a surface metal layer covering a core metal11 Aug 2026US 12,708,043 B2Rohm Co., Ltd.
- AI wiring material7 Jul 2026US 12,677,689 B2Nippon Micrometal Corporation
- Semiconductor device and method for manufacturing semiconductor device31 Mar 2026US 12,593,717 B2Kioxia Corporation
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor device and method for manufacturing semiconductor device6 Aug 2026US 2026/0231813 A1Kioxia Corporation
- Wire post bump forming process23 Jul 2026US 2026/0215313 A1Texas Instruments Incorporated
- Semiconductor package and method of manufacturing the same23 Jul 2026US 2026/0215325 A1Samsung Electronics Co., Ltd.
- Coaxial wire assemblies for semiconductor packages28 May 2026US 2026/0150745 A1SanDisk Technologies LLC
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Nanowires, nanostructures and devices fabricated therefrom394US 6,882,051 B2The Regents of the University of California · 2005
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999