H10W 72/523
Characterised by the structures of the outermost layers
Official title: {characterised by the structures of the outermost layers, e.g. multilayered coatings}
H10W72/523 (Characterised by the structures of the outermost layers) appears on 123 US grants and 137 published applications in this corpus.
Search patents in H10W- Granted patents
- 123
- Published applications
- 137
- Assignees
- 65
- Inventors
- 234
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 3 | 1 |
| 2004 | 1 | 4 |
| 2005 | 0 | 2 |
| 2006 | 1 | 2 |
| 2007 | 0 | 6 |
| 2008 | 2 | 1 |
| 2009 | 1 | 2 |
| 2010 | 2 | 7 |
| 2011 | 5 | 5 |
| 2012 | 7 | 8 |
| 2013 | 4 | 3 |
| 2014 | 6 | 7 |
| 2015 | 4 | 6 |
| 2016 | 8 | 7 |
| 2017 | 7 | 19 |
| 2018 | 15 | 10 |
| 2019 | 7 | 7 |
| 2020 | 8 | 7 |
| 2021 | 4 | 5 |
| 2022 | 5 | 3 |
| 2023 | 2 | 8 |
| 2024 | 7 | 8 |
| 2025 | 5 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Semiconductor device package with vertically stacked passive component20 Jan 2026US 12,532,786 B2Texas Instruments Incorporated
- Coated wire2 Sep 2025US 12,404,598 B2Heraeus Electronics GmbH & Co. KG
- Semiconductor device including bonding covers19 Aug 2025US 12,394,745 B2Semiconductor Components Industries, LLC
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor package and method of manufacturing the same23 Jul 2026US 2026/0215325 A1Samsung Electronics Co., Ltd.
- Coaxial wire assemblies for semiconductor packages28 May 2026US 2026/0150745 A1SanDisk Technologies LLC
- Semiconductor device package with vertically stacked passive component19 Mar 2026US 2026/0083017 A1
- Semiconductor device18 Sep 2025US 2025/0293195 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method of making contact tip structures184US 5,864,946 AForm Factor, Inc. · 1999
- Wafer-level test and burn-in, and semiconductor process171US 6,032,356 AFormFactor, Inc. · 2000
- Method of testing semiconductor135US 5,998,228 AForm Factor, Inc. · 1999
- Method and apparatus for burning-in semiconductor devices in wafer form89US 6,655,023 B1FormFactor, Inc. · 2003