Semiconductor package and method of manufacturing the same

A semiconductor package comprising:

• a package substrate comprising a substrate pad;
• a chip stack structure on the package substrate and comprising a plurality of semiconductor chips;
• a metal wire connecting a chip pad of each of the plurality of semiconductor chips with the substrate pad;
• a coating layer covering the package substrate, the chip stack structure, and the metal wire, and comprising at least one insulating layer;
• and
• a sealing material sealing the chip stack structure and the metal wire on the package substrate.

A semiconductor package comprising:

• a package substrate;
• a chip stack structure on the package substrate and comprising a plurality of semiconductor chips;
• a metal wire connecting each of the plurality of semiconductor chips to the package substrate;
• a coating layer covering the package substrate, the chip stack structure, and the metal wire, and comprising a first insulating layer and a second insulating layer;
• and
• a sealing material sealing the chip stack structure and the metal wire on the package substrate.