AI wiring material

An Al wiring material comprising an Al core material and an Al coating layer formed on a surface of the Al core material, wherein

• the Al wiring material satisfies 1.2≤H2h/H2s and 0.25D≤d2hc≤0.7D,
• where H2h is a Vickers hardness of the Al core material (Hv), H2s is a Vickers hardness of the Al coating layer (Hv), D is a diameter of the Al wiring material (μm), and d2hc is a diameter of the Al core material.

An Al wiring material comprising an Al core material and an Al coating layer formed on a surface of the Al core material, wherein

• the Al coating layer contains 0.2 to 3 mass %, in total, of one or more element selected from the group consisting of Mg, Sc, Y, Ti, Zr, Hf, V, Nb, Cr, Mo, Mn, Fe, Co, Ni, Cu, Ag, Zn and Si (hereinafter, referred to as a “first group element”), and
• the Al core material contains 0 to 500 mass ppm, in total, of a metallic element of the group 10 of the periodic table of elements.

An Al wiring material comprising an Al core material and an Al coating layer formed on a surface of the Al core material, wherein

• the Al core material contains 0.2 to 3 mass %, in total, of one or more element selected from the group consisting of Mg, Sc, Y, Ti, Zr, Hf, V, Nb, Cr, Mo, Mn, Fe, Co, Ni, Cu, Ag, Zn and Si (hereinafter, referred to as a “first group element”),
• the Al coating layer contains 0 to 500 mass ppm, in total, of a metallic element of the group 10 of the periodic table of elements, and
• the Al wiring material satisfies 0.25D≤d≤0.7D, where D is a diameter of the Al wiring material (μm) and d is a diameter of the Al core material (μm).