Semiconductor device and method for manufacturing semiconductor device

A semiconductor device, comprising:

• a wiring substrate with a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface;
• a first electrode on the first surface;
• a plurality of semiconductor chips on the wiring substrate at least one semiconductor chip in the plurality being electrically connected to the first electrode;
• a resin layer covering the plurality of semiconductor chips and the first surface from a first direction orthogonal to the first surface, a portion of the resin layer contacting the side surface of the wiring substrate from a second direction parallel to the first surface;
• an external terminal on the second surface of the wiring substrate;
• and
• a solder ball on the external terminal, wherein
• the resin layer extends in the second direction to a position beyond the side surface of the wiring substrate,
• the resin layer has an outside side surface that is substantially parallel to the first direction, and
• a bottom surface of a lowermost insulator layer formed in the semiconductor device and a bottom surface of the resin layer are substantially co-planar.