H10W 72/525
Bond wires having a filler embedded in a matrix
Official title: {Bond wires having a filler embedded in a matrix}
H10W72/525 (Bond wires having a filler embedded in a matrix) appears on 43 US grants and 51 published applications in this corpus.
Search patents in H10W- Granted patents
- 43
- Published applications
- 51
- Assignees
- 35
- Inventors
- 92
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 2 | 2 |
| 2011 | 1 | 1 |
| 2012 | 4 | 4 |
| 2013 | 2 | 0 |
| 2014 | 5 | 6 |
| 2015 | 4 | 5 |
| 2016 | 3 | 1 |
| 2017 | 4 | 7 |
| 2018 | 2 | 2 |
| 2019 | 3 | 3 |
| 2020 | 2 | 5 |
| 2021 | 2 | 0 |
| 2022 | 1 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 2 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermocompression apparatus and method for bonding electrical components to a substrate20 May 2025US 12,308,340 B2MB AUTOMATION GmbH & Co. KG
- Semiconductor device and method for fabricating the same21 Jan 2025US 12,205,909 B2United Microelectronics Corp.
- Hybrid nanosilver/liquid metal ink composition and uses thereof17 Sep 2024US 12,096,554 B2Xerox Corporation
- Semiconductor device and method for fabricating the same13 Jun 2023US 11,676,920 B2United Microelectronics Corp.
- Hybrid nanosilver/liquid metal ink composition and uses thereof22 Nov 2022US 11,510,314 B2Xerox Corporation
- Package comprising a stack of integrated devices and a plurality of wire bonds9 Apr 2026US 2026/0101805 A1QUALCOMM Incorporated
- Semiconductor device and method of manufacturing the same19 Jun 2025US 2025/0201673 A1Renesas Electronics Corporation
- Semiconductor device and method for fabricating the same3 Apr 2025US 2025/0112184 A1United Microelectronics Corp.
- Semiconductor device20 Mar 2025US 2025/0096080 A1Fuji Electric Co., Ltd.
- Thermocompression apparatus and method for bonding electrical components to a substrate19 Dec 2024US 2024/0421118 A1MB AUTOMATION GmbH & Co. KG
Most cited
By later US patents
- Semiconductor components having encapsulated through wire interconnects (TWI)62US 7,659,612 B2Micron Technology, Inc. · 2010
- Semiconductor package and method of forming15US 9,129,846 B2Samsung Electronics Co., Ltd. · 2015
- Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)12US 7,883,908 B2Micron Technology, Inc. · 2011
- Coated fine metallic wire and method for fabricating semiconductor device using same9US 6,239,376 B1NEC Corporation · 2001
- Bonding wire for semiconductor device9US 9,773,748 B2Nippon Micrometal Corporation · 2017