Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorKazuki MATSUMURA
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Abstract
A semiconductor device includes: a semiconductor chip having a source electrode pad and mounted on a die pad via a die bonding material; a wire electrically connected with the source electrode pad of the semiconductor chip; and a sealing body sealing the semiconductor chip and the wire. The wire and the source electrode pad are made of different types of metals to each other. A wire bonding layer made of sintered metal is interposed between the source electrode pad and the wire. The wire is electrically connected with the source electrode pad via the wire bonding layer.
Claims16
A semiconductor device comprising:
- a die pad;
- a lead spaced apart from said die pad;
- a semiconductor chip mounted on said die pad via a die bonding material, said semiconductor chip including a first electrode pad;
- a wire electrically connected with each of said lead and said first electrode pad of said semiconductor chip;
- and
- a sealing body sealing said semiconductor chip, said die bonding material and said wire,
- wherein said first electrode pad and said wire are made of different types of metals to each other,
- wherein a wire bonding layer made of sintered metal is interposed between said first electrode pad and said wire, and
- wherein said wire is electrically connected with said first electrode pad via said wire bonding layer.
A method of manufacturing a semiconductor device, comprising steps of:
- (a) preparing a lead frame including a die pad;
- (b) applying a first paste material onto said die pad;
- (c) mounting a semiconductor chip on said first paste material, said semiconductor chip having a first electrode pad;
- (d) arranging a second paste material containing multiple metal particles on said first electrode pad of said semiconductor chip;
- (e) sintering said multiple metal particles contained in said second paste material by heating, thereby forming a wire bonding layer;
- and
- (f) bonding a wire to said wire bonding layer, said wire being made of metal which is a different type from said first electrode pad.
Dependencies are inferred from the claim text.