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US 6,239,376 B1Granted
Coated fine metallic wire and method for fabricating semiconductor device using same
AssigneeNEC Corporation
InventorsNaoto Kimura, Takahiro Ito
Life of this patent
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Abstract
A coated fine metallic wire intended for use as a bonding wire in a semiconductor device, includes a fine metallic wire and an insulative layer which contains a pigment or dye which causes the insulative layer to absorb laser light at a high efficiency. The insulative layer is readily removable with a laser light, with no carbonized matter remaining on the fine wire and without damaging the fine wire.
Claims9
A coated metallic wire for being irradiated by a laser light having a predetermined wavelength, comprising,
- a fine metallic wire, and
- an insulative layer, which is formed around said fine metallic wire and absorbs said laser light having a predetermined wavelength, thereby to selectively remove the insulative layer on said metallic wire,
- wherein said fine metallic wire comprises gold, and wherein said insulative layer comprises nylon resin containing more than 3 but no more than 35 weight percent of iron black pigment.
Dependencies are inferred from the claim text.