Semiconductor package and method of forming
AssigneeSamsung Electronics Co., Ltd.
InventorsIn-sang Song, In-Ku Kang, Joon-hee Lee, Kyung-man Kim
Life of this patent
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Abstract
The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.
Claims17
A semiconductor package comprising:
- a package substrate comprising a bonding pad;
- a plurality of semiconductor chips stacked on the package substrate;
- and
- a bonding wire configured to electrically connect the semiconductor chips and the bonding pad;
- wherein for each semiconductor chip of at least one of the plurality of semiconductor chips, the semiconductor chip comprises:
- a semiconductor device;
- a first pad electrically connected to the semiconductor device;
- a conductive pattern;
- and
- a second pad electrically connected to the first pad, spaced apart from the conductive pattern, extending over the conductive pattern, and connected to the bonding wire.
A semiconductor package comprising:
- a package substrate;
- and
- a plurality of semiconductor chips stacked on the package substrate, at least one of the semiconductor chips comprising:
- a semiconductor device formed on a semiconductor substrate;
- a first pad electrically connected to the semiconductor device;
- a conductive pattern extending adjacent an edge of the semiconductor substrate from the first pad and integrally formed with the first pad;
- and
- a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern;
- wherein the plurality of semiconductor chips are shifted such that at least a part of the second pad of the at least one of the semiconductor chips is exposed.
Dependencies are inferred from the claim text.