Thermocompression apparatus and method for bonding electrical components to a substrate

A thermocompression apparatus for connecting electrical components to a substrate, comprising:

• a lower tool with a support surface for supporting the substrate with at least one electrical component arranged thereon, and
• an upper tool with a pressing element facing the support surface of the lower tool, wherein
• the lower tool and the upper tool are movable relative to each other in an open/close movement, wherein
• the lower tool and/or the upper tool are set up,
• to perform the open/close movement by a first drive and a second drive, wherein
• the first drive is arranged to execute a first movement in a first stroke range, the first movement having an acceleration section and a high-speed section and a deceleration section, and
• the second drive is arranged to execute a second movement in a second stroke range, wherein the second movement has an acceleration section and a high-speed section and a deceleration section, and wherein
• a movement speed during the high-speed portion of the first movement is lower than a movement speed during the high-speed portion of the second movement, and
• the first stroke range is greater than the second stroke range, and wherein
• the lower tool or the upper tool carries a thermode assembly which is associated with the support surface and/or the pressing element and which is arranged to feed heating energy into the component and/or the substrate in order to thermally cure an adhesive introduced between the component and the substrate.