Semiconductor device

A semiconductor device, comprising:

• a semiconductor chip;
• a wire electrically connected to the semiconductor chip;
• a terminal having a top surface and a bottom surface opposite to each other, and a plurality of side surfaces between the top surface and the bottom surface, the terminal having, at one side of one end thereof,
• a wire connection area on the top surface of the terminal, to which the wire is connected,
• a terminal coupling portion having a step formed by one of the plurality of side surfaces and a flat surface that is parallel to the top surface of the terminal, to form a concave portion therein at a side of the top surface of the terminal, and
• a protrusion on the top surface protruding in a direction away from the top surface and being located adjacent to the concave portion between the concave portion and the wire connection area;
• a resin case that is in contact with the bottom surface of the terminal and has a case coupling portion coupled with the terminal coupling portion such that the case coupling portion is in contact with the one of the plurality of side surfaces and the concave portion of the terminal and extends upward along the terminal coupling portion to have a height above the protrusion of the terminal, the wire connection area, the concave portion and the protrusion being located inside the resin case;
• and
• a sealing material sealing the case coupling portion and the wire connection area inside the resin case.