H10W 72/551
Materials of bond wires
Official title: {Materials of bond wires}
H10W72/551 (Materials of bond wires) appears on 16,937 US grants and 15,869 published applications in this corpus.
Search patents in H10W- Granted patents
- 16,937
- Published applications
- 15,869
- Assignees
- 2,352
- Inventors
- 21,781
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 23 | 0 |
| 1978 | 18 | 0 |
| 1979 | 14 | 0 |
| 1980 | 23 | 0 |
| 1981 | 15 | 0 |
| 1982 | 24 | 0 |
| 1983 | 23 | 0 |
| 1984 | 26 | 0 |
| 1985 | 43 | 0 |
| 1986 | 49 | 0 |
| 1987 | 62 | 0 |
| 1988 | 53 | 0 |
| 1989 | 82 | 0 |
| 1990 | 96 | 0 |
| 1991 | 133 | 0 |
| 1992 | 161 | 0 |
| 1993 | 139 | 0 |
| 1994 | 175 | 0 |
| 1995 | 175 | 0 |
| 1996 | 194 | 0 |
| 1997 | 237 | 0 |
| 1998 | 322 | 0 |
| 1999 | 342 | 0 |
| 2000 | 395 | 0 |
| 2001 | 521 | 286 |
| 2002 | 652 | 993 |
| 2003 | 770 | 979 |
| 2004 | 885 | 1042 |
| 2005 | 719 | 934 |
| 2006 | 725 | 798 |
| 2007 | 621 | 806 |
| 2008 | 495 | 821 |
| 2009 | 510 | 836 |
| 2010 | 663 | 849 |
| 2011 | 775 | 788 |
| 2012 | 682 | 712 |
| 2013 | 690 | 662 |
| 2014 | 679 | 656 |
| 2015 | 610 | 666 |
| 2016 | 628 | 524 |
| 2017 | 552 | 471 |
| 2018 | 461 | 444 |
| 2019 | 415 | 385 |
| 2020 | 378 | 463 |
| 2021 | 320 | 441 |
| 2022 | 356 | 467 |
| 2023 | 320 | 279 |
| 2024 | 309 | 273 |
| 2025 | 230 | 197 |
| 2026 | 120 | 97 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor module6 Oct 2026US 12,757,768 B2Shindengen Electric Manufacturing Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Semiconductor structure, fabrication method and package structure thereof17 Sep 2026US 2026/0283047 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Active programmable electronic devices for molecular biological analysis and diagnostics1,006US 5,605,662 ANanogen, Inc. · 1997