H10W 72/553
Not comprising solid metals or solid metalloids
Official title: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
H10W72/553 (Not comprising solid metals or solid metalloids) appears on 216 US grants and 190 published applications in this corpus.
Search patents in H10W- Granted patents
- 216
- Published applications
- 190
- Assignees
- 101
- Inventors
- 489
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 16 | 0 |
| 2001 | 10 | 5 |
| 2002 | 3 | 9 |
| 2003 | 6 | 8 |
| 2004 | 7 | 10 |
| 2005 | 9 | 5 |
| 2006 | 3 | 7 |
| 2007 | 7 | 8 |
| 2008 | 5 | 9 |
| 2009 | 1 | 11 |
| 2010 | 3 | 6 |
| 2011 | 3 | 5 |
| 2012 | 7 | 5 |
| 2013 | 8 | 7 |
| 2014 | 6 | 6 |
| 2015 | 7 | 11 |
| 2016 | 7 | 8 |
| 2017 | 10 | 14 |
| 2018 | 11 | 11 |
| 2019 | 11 | 6 |
| 2020 | 2 | 7 |
| 2021 | 4 | 7 |
| 2022 | 3 | 7 |
| 2023 | 4 | 7 |
| 2024 | 6 | 4 |
| 2025 | 7 | 3 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective wire coating during wire bonding14 Jul 2026US 12,685,229 B2SanDisk Technologies LLC
- Bonding wire for semiconductor devices9 Sep 2025US 12,412,864 B2Nippon Micrometal Corporation
- Semiconductor device including bonding covers19 Aug 2025US 12,394,745 B2Semiconductor Components Industries, LLC
- Technologies for radio frequency optimized interconnects for a quantum processor1 Jul 2025US 12,349,604 B2Intel Corporation
- Copper bonding wire17 Jun 2025US 12,334,467 B2Nippon Micrometal Corporation
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor package and method of manufacturing the same23 Jul 2026US 2026/0215325 A1Samsung Electronics Co., Ltd.
- Coaxial wire assemblies for semiconductor packages28 May 2026US 2026/0150745 A1SanDisk Technologies LLC
- Copper alloy bonding wire for semiconductor devices9 Apr 2026US 2026/0097454 A1Nippon Micrometal Corporation
- Multiple integrated circuit chip/module embedding by underfilling and direct print additive manufacturing30 Oct 2025US 2025/0336879 A1University of South Florida
Most cited
By later US patents
- Resilient contact structures for interconnecting electronic devices194US 6,778,406 B2FormFactor, Inc. · 2004
- Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof178US 5,777,391 AHitachi, Ltd. · 1998
- Resilient contact structures formed and then attached to a substrate169US 7,225,538 B2FormFactor, Inc. · 2007
- Device having resin package with projections160US 6,072,239 AFujitsu Limited · 2000
- Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures149US 6,835,898 B2FormFactor, Inc. · 2004