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US 7,225,538 B2Granted
Resilient contact structures formed and then attached to a substrate
AssigneeFormFactor, Inc.
InventorsBenjamin Niles Eldridge, Gary William Grube, Igor Yan Khandros, Gaetan L. Mathieu
Life of this patent
Estimating the term…
Abstract
Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.
Claims49
A method of forming a contact assembly comprising:
- fabricating a plurality of contact structures;
- providing a substrate comprising an array of electrical connections on a surface of said substrate;
- and
- after said fabricating step and said providing step, attaching ones of said plurality of contact structures to ones of said array of electrical connections,
- wherein said fabricating comprises:
- forming said contact structures on a sacrificial substrate, and
- removing said contact structures from said sacrificial substrate.
4 more elements
A method of forming a contact assembly comprising:
- fabricating a plurality of contact structures;
- providing a substrate comprising an array of electrical connections on a surface of said substrate;
- and
- after said fabricating step and said providing step, attaching ones of said plurality of contact structures to ones of said array of electrical connections, wherein said fabricating comprises applying a patterned layer of material to a sacrificial substrate, said patterned layer comprising openings corresponding to said contact structures.
1 more element
A method of forming a contact assembly comprising:
- fabricating a plurality of contact structures;
- providing a substrate comprising an array of electrical connections on a surface of said substrate;
- and
- after said fabricating step and said providing step, attaching ones of said plurality of contact structures to ones of said array of electrical connections, wherein said attaching comprises:
- inserting ends of said contact structures into recesses in said substrate, said recesses corresponding to said array of electrical connections on said substrate;
- and
- securing said ends of said contacts structures in said recesses.
4 more elements
A method of forming a contact assembly comprising:
- providing a substrate comprising an array of electrical connections on a surface of said substrate:
- fabricating a plurality of elongate contact structures on a sacrificial substrate in a pattern that corresponds to at least a portion of said array of electrical connections;
- after said providing step and said fabricating step, attaching ones of said plurality of contact structures to ones of said array of electrical connections;
- and
- removing said contact structures from said sacrificial substrate.
2 more elements
Dependencies are inferred from the claim text.