Copper bonding wire
AssigneesNippon Micrometal Corporation, Nippon Steel Chemical & Material Co., Ltd.
InventorsTomohiro Uno, Tetsuya Oyamada, Daizo Oda, Kota Shimomura, Tadashi Yamaguchi
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Abstract
There is provided a copper bonding wire that exhibits a favorable bondability even when a scrub at the time of bonding is reduced. The copper bonding wire is characterized in that when a sum of percentages of Cu, Cu2O, CuO and Cu(OH)2 on a surface of the wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, Cu[II]/Cu[I] which is a ratio of a total percentage of CuO and Cu(OH)2 (Cu[II]) corresponding to bivalent Cu to a percentage of Cu2O (Cu[I]) corresponding to monovalent Cu falls within a range from 0.8 to 12.
Claims7
A copper bonding wire a surface of which comprising:
- Cu, Cu2O, CuO, and Cu(OH)2,
- wherein a sum of percentages of Cu, Cu2O, CuO and Cu(OH)2 on the surface of the copper bonding wire as measured by X-ray Photoelectron Spectroscopy (XPS) is defined as 100%, and
- wherein a ratio Cu[II]/Cu[I], which is a ratio of a total percentage of CuO and Cu(OH)2 (Cu[II]) corresponding to bivalent Cu to a percentage of Cu2O (Cu[I]) corresponding to monovalent Cu, falls within a range from 0.8 to 12.
Dependencies are inferred from the claim text.